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Use of Malonic Acid in Chemical Mechanical Polishing (CMP) of Tungsten

著者名:
掲載資料名:
Science and technology of semiconductor surface preparation : symposium held April 1-3, 1997, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
477
発行年:
1997
開始ページ:
115
出版情報:
Pittsburgh, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558993815 [1558993819]
言語:
英語
請求記号:
M23500/477
資料種別:
国際会議録

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