Diffusion Barrier Property of Sputtered Molybdenum Nitride Films for Dram Copper Metallization

Diffusion Barrier Property of Sputtered Molybdenum Nitride Films for Dram Copper Metallization

著者名:

掲載資料名:

Polycrystalline thin films II : structure, properties, and applications : symposium held November 27-December 1, 1995, Boston, Massachusetts, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

403

発行年:

1996

開始ページ:

687

出版情報:

Pittsburgh, Pa.: MRS - Materials Research Society

ISSN:

02729172

ISBN:

9781558993068 [1558993061]

言語:

英語

請求記号:

M23500/403

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00020303
シリーズID:	PA00000011
会議名:	Symposium on polycrystalline thin films
回次:	2nd
会議開催地:	Boston, MA, USA
会議開催年:	1995.11.27-1995.12.01

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