Effectiveness and Reliability of Metal Diffusion Barriers for Copper Interconnects

Effectiveness and Reliability of Metal Diffusion Barriers for Copper Interconnects

著者名:

Bai, G.

掲載資料名:

Polycrystalline thin films II : structure, properties, and applications : symposium held November 27-December 1, 1995, Boston, Massachusetts, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

403

発行年:

1996

開始ページ:

501

出版情報:

Pittsburgh, Pa.: MRS - Materials Research Society

ISSN:

02729172

ISBN:

9781558993068 [1558993061]

言語:

英語

請求記号:

M23500/403

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00020303
シリーズID:	PA00000011
会議名:	Symposium on polycrystalline thin films
回次:	2nd
会議開催地:	Boston, MA, USA
会議開催年:	1995.11.27-1995.12.01

類似資料:

1 国際会議録 EFFECTIVENESS OF NITRIDE DIFFUSION BARRIERS IN A SELF-ENCAPSULATED COPPER-BASED METALLIZATION Adams, D., Spreitzer, R. L., Russell, S. W., Theodore, N. D., Alford, T. L., Mayer, J. W. MRS - Materials Research Society	7 国際会議録 The Influence of TiW Barrier Layer on Reliability of AlCu and AlSiCu Interconnects Kordic, S., Wolters, R. A. M., Augur, R. A., Dirks, A. G. MRS - Materials Research Society
2 国際会議録 Microtexture And Strain In Electroplated Copper Interconnects Spolenak, R., Barr, D.L., Gross, M.E., Evans-Lutterodt, K., Brown, W.L., Tamura, N., Macdowell, A.A., Celestre, R.S., … Materials Research Society	8 国際会議録 The Effect of Grain Boundaries on Surface Diffusion Mediated-Planarization of Polycrystalline Cu Films Brain, R. A., Gardner, D. S., Fraser, D. B., Atwater, H. A. MRS - Materials Research Society
3 国際会議録 Microtexture and Strain in Electroplated Copper Interconnects Spolenak, R., Barr, D.L., Gross, M.E., Evans-Lutterodt, K., Brown, W.L., Tamura, N., Macdowell, A.A., Celestre, R.S., … Materials Research Society	9 国際会議録 Suppress Copper Diffusion through Barrier Metal-Free Hydrogen Silisequioxane Dielectrics by Using NH3 Plasma Treatment Chang, K.M., Deng, I-C., Yeh, S-J., Yeh, T-H. Electrochemical Society
4 国際会議録 Copper metallization for on-chip interconnects Gelatos,A.V., Nguyen,B.-Y., Perry,K.A., Marsh,R., Peschke,J., Filipiak,S., Travis,E.O., Thompson,M.A., Saaranen,T., … SPIE-The International Society for Optical Engineering	10 国際会議録 Copper Metallization Layers on Bismuth-Telluride Substrates: Effectiveness of Cr, Pt, and Ta40Si14N46 Thin Films As Diffusion Barriers Kacsich, T., Nicolet, M-A., Kolawa, E., Fleurial, J-P. MRS - Materials Research Society
5 国際会議録 Strain Measurement and Calculation in Passivated Cu Lines Deposited by Three Different Methods Marieb, T., Mack, A. S., Cox, N., Gardner, D., Mu, X. C. MRS - Materials Research Society	11 国際会議録 Organic Solution Deposition Of Copper Seed Layers Onto Barrier Metals Gu, H., Fang, R., O'Keefe, T.J., O'Keefe, M.J., Shih, W.S., Snook, J.A., Jeedy, K.D., Cortez, R. Materials Research Society
6 国際会議録 Effect of Modified Metal/Passivation Interfaces on Stress Voiding in Interconnects Kalnas, C. E., Keller, R. R., Phelps, J. M., Marieb, T. N. MRS - Materials Research Society	12 国際会議録 Advanced CVD Barrier Technology for Copper Interconnect Jain, A., Adetutu, O., Ekstrom, B., Hamilton, G., Herrick, M., Venkatraman, R., Weitzman, E. MRS - Materials Research Society

1

2

3

4

5

6

7

8

9

10

11

12