Blank Cover Image

Diffusion and Electromigration of Cu in Single Crystal Al Interconnects

著者名:
掲載資料名:
Materials reliability in microelectronics VIII : symposium held April 13-16, 1998, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
516
発行年:
1998
開始ページ:
71
出版情報:
Pittsburgh, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558994225 [155899422X]
言語:
英語
請求記号:
M23500/516
資料種別:
国際会議録

類似資料:

1 国際会議録 Electromigration failure modes and Blech effect in single-inlaid Cu interconnects

Thrasher,S., Capasso,C., Zhao,L., Hernandez,R., Mulski,P., Rose,S., Nguyen,T., Kawasaki,H.

SPIE-The International Society for Optical Engineering
7 国際会議録 The Effects Of The Mechanical Properties Of The Confinement Material On Electromigration In Metallic Interconnects

Hau-Riege, S.P., Thompson, C.V.

Materials Research Society
2 国際会議録 ELECTROMIGRATION IN Al/W AND Al(Cu)/W INTERCONNECT STRUCTURES

Hu, C-K., Ho, P. S., Small, M. B., Kelleher, K.

Materials Research Society
8 国際会議録 Electromigration Damage and Failure Distributions in Al-4wt.%Cu Interconnects

Shih, W. C., Greer, A. L.

MRS - Materials Research Society
3 国際会議録 Electromigration and Diffusion in Pure Cu and Cu(Sn) Alloys

Hu, C.-K., Lee, K. L., Gupta, D., Blauner, P.

MRS - Materials Research Society
9 国際会議録 IN-SITU ELECTROMIGRATION STRESSING IN TRANSMISSION ELECTRON MICROSCOPY FOR Al-Cu INTERCONNECTS

Shih, W. C., Greer, A. L.

MRS - Materials Research Society
4 国際会議録 Electromigration and Diffusion in Pure Cu and Cu(Sn) Alloys

Hu, C-K., Lee, K. L., Gupta, D., Blauner, P.

MRS - Materials Research Society
10 国際会議録 Electromigration in on-chip Single/dual Damascene Cu interconnections*

Hu, C.-K, Gignac, L., Liniger, E., Rosenberg, R.

Electrochemical Society
5 国際会議録 Electromigration Voiding in Argon-Implanted Interconnects

Meier, N. E., Doan, J. C., Marieb, T. N., Flinn, P. A., Bravman, J. C.

MRS - Materials Research Society
11 国際会議録 Comparison of Electromigration in Cu Interconnects with ALD or PVD TaN Liners

C. Hu, L. Gignac, E. Liniger, S. Grunow, A. Simon

Electrochemical Society
6 国際会議録 RELIABILITY OF INTERCONNECTS EXHIBITING BIMODAL ELECTROMIGRATION-INDUCED FAILURED DISTRIBUTIONS

Kahn, H., Thompson, C. V., Cooperman, S. S.

Materials Research Society
12 国際会議録 MICROSTRUCTURE, DAMAGE AND RESISTANCE DURING ELECTROMIGRATION LIFE-TESTING OF Al-Cu INTERCONNECTS

Shih, W. C., Greer, A. L., Xu, Y. Z., Jones, B. K.

MRS - Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12