Thermal Curing Conditions for Low-k Fluorinated Polyimide Film for Use as the Interlayer Dielectric in ULSI

Thermal Curing Conditions for Low-k Fluorinated Polyimide Film for Use as the Interlayer Dielectric in ULSI

著者名:

掲載資料名:

Low-dielectric constant materials II : symposium held December 2-3, 1996, Boston, Massachusetts, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

443

発行年:

1997

開始ページ:

71

出版情報:

Pittsburgh, Pa.: MRS - Materials Research Society

ISSN:

02729172

ISBN:

9781558993471 [1558993479]

言語:

英語

請求記号:

M23500/443

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00019838
シリーズID:	PA00000011
会議名:	Symposium on low-dielectric constant materials
回次:	2nd
会議開催地:	Boston, MA, USA
会議開催年:	1996.12.02-1996.12.03

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