Characterization of SOG(spin on glass)fully etch back process for multilevel interconnection technology
- 著者名:
Huang,Y.C. ( Taiwan Semiconductor Manufacturing Co. ) Huang,M.H. Chen,S.F. Yu,C.H. Liu,L.M. Lin,M.S. - 掲載資料名:
- Microelectronic Device and Multilevel Interconnection Technology
- シリーズ名:
- Proceedings of SPIE - the International Society for Optical Engineering
- シリーズ巻号:
- 2636
- 発行年:
- 1995
- 開始ページ:
- 289
- 終了ページ:
- 298
- 出版情報:
- Bellingham, Wash.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819420022 [0819420026]
- 言語:
- 英語
- 請求記号:
- P63600/2636
- 資料種別:
- 国際会議録
類似資料:
SPIE-The International Society for Optical Engineering |
SPIE - The International Society of Optical Engineering |
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
Society of Photo-optical Instrumentation Engineers |
Trans Tech Publications |
SPIE-The International Society for Optical Engineering |
Materials Research Society |
SPIE-The International Society for Optical Engineering |
11
国際会議録
Performance and Reliability of InGaN-GaN Light-Emitting Diodes with Mirror Wafer Bonding Technology
Electrochemical Society |
SPIE - The International Society for Optical Engineering |
Trans Tech Publications |