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FRACTURE TOUGHNESS OF SILICON AND THIN FILM MICRO-STRUCTURES BY WEDGE INDENTATION

著者名:
掲載資料名:
Thin films : stresses and mechanical properties IV : symposium held April 12-16, 1993, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
308
発行年:
1993
開始ページ:
647
出版情報:
Pittsburgh, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558992047 [1558992049]
言語:
英語
請求記号:
M23500/308
資料種別:
国際会議録

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