Interconnect Failure Mechanism Maps for Different Metallization Materials and Processes

Interconnect Failure Mechanism Maps for Different Metallization Materials and Processes

著者名:

掲載資料名:

Materials reliability in microelectronics IX : symposium held April 6-8, 1999, San Francisco, California, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

563

発行年:

1999

開始ページ:

59

出版情報:

Pittsburgh, Pa.: MRS - Materials Research Society

ISSN:

02729172

ISBN:

9781558994706 [155899470X]

言語:

英語

請求記号:

M23500/563

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00019385
シリーズID:	PA00000011
会議名:	Symposium on materials reliability in microelectronics
回次:	4th
会議開催地:	San Francisco, CA, USA
会議開催年:	1999.04.06-1999.04.08

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