Drop Performance Simulation for Packages of Wireless Electronic Products

Drop Performance Simulation for Packages of Wireless Electronic Products

著者名:

Wu, Y. ( Motorola, Inc. )
Song, G.
Wu, J.
Yeh, C. -P.
Wyatt, K.

掲載資料名:

Conference proceedings at ANTEC '98 : plastics on my mind, Society of Plastics Engineers, Atlanta, Georgia, April 26-April 30, 1998

シリーズ名:

Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers

シリーズ巻号:

44(3)

発行年:

1998

巻:

3

開始ページ:

3161

終了ページ:

3164

総ページ数:

4

出版情報:

Brookfield Center, CT: Society of Plastics Engineers, Inc. (SPE)

ISBN:

9781566766692 [1566766699]

言語:

英語

請求記号:

S42700/44-3

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00019223
シリーズID:	PA00000030
会議名:	ANTEC '98 : Annual Technical Conference
回次:	56th
会議開催地:	Atlanta, GA, USA
会議開催年:	1998.04.26-1998.04.30
論文注記:	ENGINEERING PROPERTIES AND STRUCTURE/FAILURE ANALYSIS AND PREVENTION DIVISION

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