Assessment of Fatigue Strength of Beam Lead in ヲフBGA Package using Mechanical Fatigue Tester
- 著者名:
Lee,Hyouk ( Samsung Electronics Co. ) Park,Jun Hyub Kim,Moon Cheol Choi,Mun Cheol Moon,Ho Jeong Kim,Young Soo Oh,Se Yong - 掲載資料名:
- Proceedings : 1999 International Symposium on Microelectronics : 26-28 October 1999, Chicago, Illinois
- シリーズ名:
- Proceedings of SPIE - the International Society for Optical Engineering
- シリーズ巻号:
- 3906
- 発行年:
- 1999
- 開始ページ:
- 694
- 終了ページ:
- 698
- 出版情報:
- Bellingham, Wash.: SPIE - The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780930815585 [0930815580]
- 言語:
- 英語
- 請求記号:
- P63600/3906
- 資料種別:
- 国際会議録
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