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Effects of PECVD W-N diffusion barrier on thermal stress and electrical properties of Cu/W-N/SiOF multilevel interconnect

著者名:
Kim,Y.T. ( Korea Institute of Science and Technology )
Kim,D.J.
Lee,S.
Park,Y.K.
Kim,I.-S.
Park,J.-W.
さらに 1 件
掲載資料名:
In-line characterization, yield reliability, and failure analysis in microelectronics manufacturing : 19-21 May 1999, Edinburgh, Scotland
シリーズ名:
Proceedings of SPIE - the International Society for Optical Engineering
シリーズ巻号:
3743
発行年:
1999
開始ページ:
227
終了ページ:
233
出版情報:
Bellingham, Wash.: SPIE - The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819432230 [0819432237]
言語:
英語
請求記号:
P63600/3743
資料種別:
国際会議録

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