Blank Cover Image

INTERFACIAL REACTIONS OF COPPER / REFRACTORY ALLOY AND BILAYER FILMS ON SiO2

著者名:
Spreitzer, R. L.
Rafalski, S. A.
Adams, D.
Russell, S. W.
Atzmon, Z.
Li, J.
Alford, T. L.
Mayer, J. W.
さらに 3 件
掲載資料名:
Advanced metallization for devices and circuits--science, technology, and manufacturability : symposium held April 4-8, 1994, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
337
発行年:
1994
開始ページ:
631
出版情報:
Pittsburgh, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558992375 [1558992375]
言語:
英語
請求記号:
M23500/337
資料種別:
国際会議録

類似資料:

1 国際会議録 ENHANCED ADHESION OF COPPER FILMS TO SiO2, PSG AND BPSG BY REFRACTORY METAL ADDITIONS

Rafalski, S. A., Spreitzer, R. L., Russell, S. W., Alford, T. L., Li, J., Moinpour, M., Moghadam, F., Mayer, J. W.

MRS - Materials Research Society
7 国際会議録 Cobalt and Titanium Metallization of SiGeC for Shallow Contacts

Bair, A. E., Alford, T. L., Atzmon, Z., Marcus, S. D., Doller, D. C., Morton, R., Lau, S. S., Mayer, J. W.

MRS - Materials Research Society
2 国際会議録 Indluence of Interfacial Copper on the Ti-SiO2 Reaction during Nitridatin of Cu-Ti Films

Adams, Daniel, Alford, T. L., Theodore, N. D., Laursen, T., Russell, S. W., Kim, M. J.

MRS - Materials Research Society
8 国際会議録 The Formation of TiN-Encapsulated Silver Films by Nitridation of Silver-Refractory Metal Alloys in NH3

Adams, Daniel, Alford, T. L., Laursen, T., Deng, F., Morton, R., Lau, S. S.

MRS - Materials Research Society
3 国際会議録 EFFECTIVENESS OF NITRIDE DIFFUSION BARRIERS IN A SELF-ENCAPSULATED COPPER-BASED METALLIZATION

Adams, D., Spreitzer, R. L., Russell, S. W., Theodore, N. D., Alford, T. L., Mayer, J. W.

MRS - Materials Research Society
9 国際会議録 X-ray Diffraction Analysis of the Strain of SiGeC/(100)Si Alloys

Bair, A. E., Alford, T. L., Atzmon, S. Sego, Culbertson, R. J.

MRS - Materials Research Society
4 国際会議録 INVESTIGATION OF CHROMIUM NITRIDATION USING ION BEAM RESONANCE ANALYSIS

Russell, S. W., Bair, A. E., Rack, M. J., Adams, D., Spreitzer, R. L., Alford, T. L., Culbertson, R. J.

MRS - Materials Research Society
10 国際会議録 Thermal Stability of Ti-Mo and Ti-Cu Bilayer Thin Films on Alumina

Strane J., Li J., Russell W. S., Mayer W. J.

Kluwer Academic Publishers
5 国際会議録 Low Temperature Oxidation of Silicon after Copper Ion Implantation

Jaquez, E. J., Alford, T. L., Theodore, N. D., Adams, D., Li, Jian, Russell, S. W., Anders, Simone

MRS - Materials Research Society
11 国際会議録 Kinetics Model For The Self-Encapsulation Of Ag/Al Bilayers

Wang, Y., Alford, T.L., Mayer, J.W.

Materials Research Society
6 国際会議録 KINETICS OF COPPER GRAIN GROWTH DURING NITRIDATION OF Cu-Cr AND Cu-Ti THIN FILMS BY IN SITU TEM

Atzmon, Z., Sharma, R., Russell, S. W., Mayer, J. W.

MRS - Materials Research Society
12 国際会議録 Encapsulation of Silver Via Nitridation of Ag/Ti Bilayer Structures

Zou, Y. L., Alford, T. L., Adams, D., Laursen, T., Tu, K.-N., Morton, R., Lau, S. S.

MRS - Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12