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KINETICS OF COPPER GRAIN GROWTH DURING NITRIDATION OF Cu-Cr AND Cu-Ti THIN FILMS BY IN SITU TEM

著者名:
掲載資料名:
Advanced metallization for devices and circuits--science, technology, and manufacturability : symposium held April 4-8, 1994, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
337
発行年:
1994
開始ページ:
625
出版情報:
Pittsburgh, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558992375 [1558992375]
言語:
英語
請求記号:
M23500/337
資料種別:
国際会議録

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