Blank Cover Image

Modified low-temperture direct bonding method for vacuum microelectronics application

著者名:
Ju,B.-K. ( Korea Institute of Science and Technology )
Lee,D.-J.
Choi,W.-B.
Lee,Y.-H.
Jang,J.
Lee,K.-B.
Oh,M.-H.
さらに 2 件
掲載資料名:
Smart structures and materials 1997 : Smart electronics and MEMS : 4-6 March 1997, San Diego, California
シリーズ名:
Proceedings of SPIE - the International Society for Optical Engineering
シリーズ巻号:
3046
発行年:
1997
開始ページ:
342
終了ページ:
348
出版情報:
Bellingham: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819424594 [0819424595]
言語:
英語
請求記号:
P63600/3046
資料種別:
国際会議録

類似資料:

1 国際会議録 A Low Temperature Direct Bonding Method Using an Electron-Beam Evaporated Silicon-Oxide Interlayer

Park, H. W., Ju, B. K., Lee, Y. H., Park, J. H., Lee, N. Y., Koh, K. H., Shin, D. K., Kang, I. B., Samaan, N., Haskard, …

MRS - Materials Research Society
7 国際会議録 Electrostatically vacuum-sealed tunneling magnetic field sensors

Park,H.W., Ju,B.K., Lee,J., Park,J.H., Oh,M.H.

SPIE-The International Society for Optical Engineering
2 国際会議録 A Study of Hermetic Glass Sealing Using a Modified Direct Bonding Method

Ju, B. K., Ko, C. G., Lee, Y. H., Kang, I. B., White, P., Samaan, N., Haskard, M., Oh, M. H.

MRS - Materials Research Society
8 国際会議録 Quality Improvement of 4″ 4H-SiC Crystal by Using Modified Seed Adhesion Method

J.W. Choi, J.H. Park, J.D. Seo, J.G. Kim, M.O. Kyun, K.R. Ku, H.J. Kim, D.H. Lee, Y.S. Jang, W.J. Lee

Trans Tech Publications
3 国際会議録 New vacuum packaging method of field emission display

Ju,B.K., Choi,W.B., Jeong,S.J., Lee,N.Y., Han,J.I., Cho,K.I., Oh,M.-H.

SPIE-The International Society for Optical Engineering
9 国際会議録 Eigenvalue Analysis of Roots Type Vacuum Pump Using FE-Method

J.H. Lee, J.M. Lee, J.M. Ha, D.S. Gu, B.K. Choi

Trans Tech Publications
4 国際会議録 Anodic bonding technique for silicon-to-ITO coated glass bonding

Choi,W.-B., Ju,B.-K., Lee,Y.-H., Oh,M.-H., Sung,M.-Y.

SPIE-The International Society for Optical Engineering
10 国際会議録 Developments of optimum flip-chip bonding process

Jang,D.H., Kang,S.K., Lee,Y.M., Oh,S.Y.

SPIE-The International Society for Optical Engineering
5 国際会議録 Direct bonding between spacer and field emitter array using an electron-beam-evaporated interlayer

Park,H.-W., Ju,B.-K., Lee,Y.-H., Kang,I.-B., Samaan,N.D., Haskard,M.R., Park,J.-H., Oh,M.-H.

SPIE-The International Society for Optical Engineering
11 国際会議録 Application of TLP (Transient Liquid Phase) Bonding Method to the High Tm Lead-Free Solder

Lee, J. S., Bang, W. H., Jung, J. P., Oh, K. H.

Trans Tech Publications
6 国際会議録 Experimental Analysis of the Process of Anodic Bonding Using an Evaporated Glass Layer

Choi, W. B., Ju, B. K., Lee, Y. H., Haskard, M. R., Jeong, S. J., Lee, N. Y., Sung, M. Y., Oh, M. H.

MRS - Materials Research Society
12 国際会議録 Micromachined silicon actuators with low driving voltage and high accuracy for optical switches and tunable filters

Lee,J.H., Lee,M.L., Jang,W.I., Choi,C.A., Kim,K.

SPIE - The International Society for Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12