Experimental Verification of Simulating Shrinkage and Warpage of Thin Compression Molded SMC Parts
- 著者名:
- Osswald, T. A. ( University of Wisconsin-Madison )
- Sun, E. M. ( The Madison Group: Polymer Processing Research Corp. )
- Tseng, S. -C.
- Gramann, P. J.
- 掲載資料名:
- ANTEC 94 : plastics : gateway to the future : conference proceedings, San Francisco May 1-5 1994 : Volume I. Processing
- シリーズ名:
- Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers
- シリーズ巻号:
- 40(1)
- 発行年:
- 1994
- 巻:
- 1
- 開始ページ:
- 914
- 終了ページ:
- 917
- 総ページ数:
- 4
- 出版情報:
- Brookfield, CT: Society of Plastics Engineers, Inc. (SPE)
- 言語:
- 英語
- 請求記号:
- S42700/941468
- 資料種別:
- 国際会議録
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