In-line monitoring of chemical-mechanical polishing processes

In-line monitoring of chemical-mechanical polishing processes

著者名:

Hetherington,D.L. ( Sandia National Labs. )
Stein,D.J.

掲載資料名:

In-Line Methods and Monitors for Process and Yield Improvement

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

3884

発行年:

1999

開始ページ:

24

終了ページ:

35

出版情報:

Bellingham, Wash.: SPIE - The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819434814 [0819434817]

言語:

英語

請求記号:

P63600/3884

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00018101
シリーズID:	PA00000029
会議名:	Microelectronic Manufacturing : In-Line Methods and Monitors for Process and Yield Improvement
回次:	1999
会議開催地:	Santa Clara, CA, USA
会議開催年:	1999.09.22-1999.09.23

類似資料:

1 国際会議録 Recent advances in endpoint and in-line monitoring techniques for chemical-mechanical polishing processes Stein,D.J., Hetherington,D.L. SPIE-The International Society for Optical Engineering	7 国際会議録 Integrated mold/surface-micromachining process Barron,C.C., Fleming,J.G., Montague,S., Sniegowski,J.J., Hetherington,D.L. SPIE-The International Society for Optical Engineering
2 国際会議録 Prediction of tungsten CMP pad life using blanket removal rate data and endpoint data obtained from process temperature and carrier motor current measurements Stein,D.J., Hetherington,D.L. SPIE - The International Society for Optical Engineering	8 国際会議録 Review and Experimental Analysis of Oxide CMP Models Stein, David J., Hetherington, Dale L. Electrochemical Society
3 国際会議録 Analysis of in-situ vibration monitoring for end-point detection of CMP planarization processes Hetherington,D.L., Stein,D.J., Lauffer,J.P., Wyckoff,E.E., Shingledecker,D.M. SPIE - The International Society for Optical Engineering	9 国際会議録 Evaluation of pad life in chemical mechanical polishing process using statistical metrology Muthukrishnan,N.M., Prasad,S., Stine,B.E., Loh,W., Nagahara,R., Chung,J.E., Boning,D.S. SPIE-The International Society for Optical Engineering
4 国際会議録 Improved polysilicon surface-micromachined micromirror devices using chemical-mechanical polishing Hetherington, Dale L., Sniegowski, Jeffry J. SPIE	10 国際会議録 Line-edge roughness in positive-tone chemically amplified resists: effect of additives and processing conditions Lin,Q., Goldfarb,D.L., Angelopoulos,M., Sriram,S.R., Moore,J.S. SPIE-The International Society for Optical Engineering
5 国際会議録 The Chemical-Mechanical Polishing of Copper with Model Slurries Lee, B-C., Duquette, D.J., Gutmann, R.J. Electrochemical Society	11 国際会議録 In-process nondestructive evaluation of the pultrusion process D.L. Fecko, D. Heider, J.W. Gillespie, Jr., K.V. Steiner Society of Photo-optical Instrumentation Engineers
6 国際会議録 Novel method of predicting lot polish time for high-volume oxide chemical mechanical polishing Schroeder,D.J., Buley,T.W., Chan,J.A. SPIE - The International Society for Optical Engineering	12 国際会議録 Surface-Particle Interactions in the Chemical Mechanical Polishing Process Adler, J. J., Rabinovich, Y. I., Singh, R. K., Moudgil, B. M. MRS - Materials Research Society

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