On the Simulation of Microelectronic Encapsulation with Epoxy Molding Compound

On the Simulation of Microelectronic Encapsulation with Epoxy Molding Compound

著者名:

Turng, L. S. ( AC Technology )
Wang, V. W.

掲載資料名:

Back to the future : conference proceedings : ANTEC 1992, Detroit, May 3-7

シリーズ名:

Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers

シリーズ巻号:

38

発行年:

1992

パート:

1

開始ページ:

84

終了ページ:

88

総ページ数:

5

出版情報:

Brookfield Center, CT: Society of Plastics Engineers, Inc. (SPE)

言語:

英語

請求記号:

S42700/921583

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00017837
シリーズID:	PA00000030
会議名:	ANTEC 1992 : Annual Technical Conference
回次:	50th
会議開催地:	Detroit, MI, USA
会議開催年:	1992.05.03-1992.05.07
論文注記:	ELECTRICAL & ELECTRONIC DIVISION
書誌注記:	目次はDivisionごとに分けて掲載されている。論文の順番はDivisionにかかわらず，Session順の通しページになっている。

類似資料:

1 国際会議録 Simulation of Co-Injection and Gas-Assisted Injection Molding Turng, L. S. Society of Plastics Engineers, Inc. (SPE)	7 国際会議録 Development of an Integrated Computer-Aided Engineering and Optimization System for Injection Molding (660) Peic,M., Turng,L-S. Society of Plastic Engineers.
2 国際会議録 Microcellular Injection Molding Turng, L-S.T. Society of Plastics Engineers	8 国際会議録 Study of the Chemorheology of a Highly-Filled Epoxy Molding Compound Chang -Y. R., Lin Y., Lin -S. F., Yang -S. W., Hsu -H. C. Society of Plastics Engineers, Inc. (SPE)
3 国際会議録 Computer-Aided-Engineering for the Gas-Assisted Injection Molding Process Turng, L. S. Society of Plastics Engineers, Inc. (SPE)	9 国際会議録 General Design Guidelines for Gas-Assisted Injection Molding Using a CAE Tool Barton, K. S., Turng, L. S. Society of Plastics Engineers, Inc. (SPE)
4 国際会議録 New Developments in CAET Technology for the Gas-Assisted Injection Molding Process Turng S. L. Society of Plastics Engineers, Inc. (SPE)	10 国際会議録 Optimization Strategies for Injection Molding Turng S. L., Chiang H. H., Stevenson F. J. Society of Plastics Engineers, Inc. (SPE)
5 国際会議録 Design of Mold Materials for Encapsulating Semiconductors Using Epoxy Molding Compounds S. Kitaoka, N. Kawashima, K. Maeda, T. Kuno, Y. Noguchi Trans Tech Publications	11 国際会議録 Low-Alpha Epoxy Molding Compounds Rauhut, H. W. Society of Plastics Engineers, Inc. (SPE)
6 国際会議録 A Web-Based Knowledge Management System for the Injection Molding Process Turng, L. -S., DeAugistine, D. Society of Plastics Engineers, Inc. (SPE)	12 国際会議録 Simulation of Molding Flow of Sheet Molding Compound in Complicated Dies Q.L. Mei, S.L. Yan, Z.X. Huang, J.J. Guo Trans Tech Publications

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