Post Filling Simulation, Mold Cooling, and Part Warpage
- 著者名:
- Davidoff, A. ( Cisigraph )
- Jacque, F. ( Chun Yuan Christian University )
- Chen, S. C. ( French Atomic Committee )
- Bung, H.
- 掲載資料名:
- Back to the future : conference proceedings : ANTEC 1992, Detroit, May 3-7
- シリーズ名:
- Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers
- シリーズ巻号:
- 38
- 発行年:
- 1992
- パート:
- 2
- 開始ページ:
- 1882
- 終了ページ:
- 1886
- 総ページ数:
- 5
- 出版情報:
- Brookfield Center, CT: Society of Plastics Engineers, Inc. (SPE)
- 言語:
- 英語
- 請求記号:
- S42700/921583
- 資料種別:
- 国際会議録
類似資料:
Society of Plastics Engineers, Inc. (SPE) |
Society of Plastics Engineers, Inc. (SPE) |
2
国際会議録
Hybrid Methods for Injection Mold Cooling Process Simulation and Mold Cooling System Analysis
Society of Plastics Engineers, Inc. (SPE) |
Society of Plastics Engineers |
Society of Plastics Engineers, Inc. (SPE) |
Society of Plastics Engineers, Inc. (SPE) |
Society of Plastics Engineers, Inc. (SPE) |
Society of Plastics Engineers, Inc. (SPE) |
Society of Plastics Engineers, Inc. (SPE) |
Society of Plastics Engineers, Inc. (SPE) |
Society of Plastics Engineers, Inc. (SPE) |
Society of Plastics Engineers, Inc. (SPE) |