Simulation of Warpage Caused by Thermal and Geometric Asymmetries in Injection Molded Articles
- 著者名:
- Rietveld, J. X. ( University of Wisconsin-Madison )
- Liu, S. -J.
- 掲載資料名:
- Back to the future : conference proceedings : ANTEC 1992, Detroit, May 3-7
- シリーズ名:
- Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers
- シリーズ巻号:
- 38
- 発行年:
- 1992
- パート:
- 1
- 開始ページ:
- 1349
- 終了ページ:
- 1353
- 総ページ数:
- 5
- 出版情報:
- Brookfield Center, CT: Society of Plastics Engineers, Inc. (SPE)
- 言語:
- 英語
- 請求記号:
- S42700/921583
- 資料種別:
- 国際会議録
類似資料:
1
国際会議録
Modelling and Simulation of Thermally Induced Stress and Warpage in Injection Molded Thermoplastics
Society of Plastics Engineers, Inc. (SPE) |
Society of Plastics Engineers, Inc. (SPE) |
Society of Plastics Engineers, Inc. (SPE) |
Society of Plastics Engineers |
Society of Plastics Engineers, Inc. (SPE) |
Society of Plastics Engineers, Inc. (SPE) |
Society of Plastics Engineers |
Society of Plastics Engineers, Inc. (SPE) |
Society of Plastics Engineers, Inc. (SPE) |
Society of Plastics Engineers, Inc. (SPE) |
Society of Plastics Engineers, Inc. (SPE) |
Society of Plastics Engineers, Inc. (SPE) |