Novel metallization scheme using nitrogen passivated Ti liner for AlCu-based metallization

Novel metallization scheme using nitrogen passivated Ti liner for AlCu-based metallization

著者名:

Schmidbauer,S. ( Infineon Technologies AG )
Spinler,S.
Lehr,M.U.
Klotzsche,J.
Hahn,J.

掲載資料名:

Multilevel Interconnect Technology III

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

3883

発行年:

1999

開始ページ:

148

終了ページ:

158

出版情報:

Bellingham, Wash.: SPIE - The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819434807 [0819434809]

言語:

英語

請求記号:

P63600/3883

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00017633
シリーズID:	PA00000029
会議名:	Microelectronic Manufacturing : Multilevel Interconnect Technology
回次:	1999 : 3rd
会議開催地:	Santa Clara, CA, USA
会議開催年:	1999.09.22-1999.09.23

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