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WAFER BONDING FOR HYBRID CIRCUIT THCHNOLOGY USING SOLID-STATE REACTIONS

著者名:
Ma, Z.
Zhou, G. L.
Shen, T. C.
Lin, M. E.
Hsieh, K. C.
Allen, L. H.
Morkoc, H.
さらに 2 件
掲載資料名:
Joining and adhesion of advanced inorganic materials : symposium held April 12-14, 1993, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
314
発行年:
1993
開始ページ:
241
出版情報:
Pittsburgh, PA: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558992122 [155899212X]
言語:
英語
請求記号:
M23500/314
資料種別:
国際会議録

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