In Situ Study of Al2Cu Precipitate Evolution During Electromigration in Submicron Al Interconnects
- 著者名:
- 掲載資料名:
- Materials reliability in microelectronics VI : symposium held April 8-12, 1996, San Francisco, California, U.S.A.
- シリーズ名:
- Materials Research Society symposium proceedings
- シリーズ巻号:
- 428
- 発行年:
- 1996
- 開始ページ:
- 207
- 出版情報:
- Pittsburgh, Pa.: MRS - Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558993310 [1558993312]
- 言語:
- 英語
- 請求記号:
- M23500/428
- 資料種別:
- 国際会議録
類似資料:
MRS - Materials Research Society |
MRS - Materials Research Society |
2
国際会議録
The Effect of Cu Concentration and Distribution on the Lifetimes of Submicron, Bamboo Al(Cu) Runners
MRS - Materials Research Society |
8
国際会議録
MICROSTRUCTURE, DAMAGE AND RESISTANCE DURING ELECTROMIGRATION LIFE-TESTING OF Al-Cu INTERCONNECTS
MRS - Materials Research Society |
MRS - Materials Research Society |
Trans Tech Publications |
MRS - Materials Research Society |
Materials Research Society |
5
国際会議録
Behaviors of Precipitates, Voids, and Hillocks in Electromigration Stressed Al-2 wt%Cu Interconnects
MRS - Materials Research Society |
MRS - Materials Research Society |
MRS - Materials Research Society |
Materials Research Society |