Thermal shift in the exciton absorption maxima as a function of the chip package design

Thermal shift in the exciton absorption maxima as a function of the chip package design

著者名:

掲載資料名:

Optoelectronic Packaging

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

2691

発行年:

1996

開始ページ:

162

終了ページ:

170

出版情報:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819420657 [0819420654]

言語:

英語

請求記号:

P63600/2691

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00017476
シリーズID:	PA00000029
会議名:	Photonics West : Optoelectronic Packaging
回次:	1996
会議開催地:	San Jose, CA, USA
会議開催年:	1996.02.01-1996.02.02

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