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Microstructural Investigation of Grain Boundary Diffusion and Recrystallization in W-Cu Composites

著者名:
掲載資料名:
Intergranular and interphase boundaries in materials : iib92 : proceedings of the 6th International Congress, Thessaloniki, Greece, June 21-26, 1992
シリーズ名:
Materials science forum
シリーズ巻号:
126-128
発行年:
1993
開始ページ:
399
終了ページ:
402
出版情報:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
ISBN:
9780878496600 [0878496602]
言語:
英語
請求記号:
M23650
資料種別:
国際会議録

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