Statistical design of experimental analysis of TiN films deposited by ion metal plasma PVD for sub-0.25-ｦﾌm IC process applications

Statistical design of experimental analysis of TiN films deposited by ion metal plasma PVD for sub-0.25-ｦﾌm IC process applications

著者名:

Hui,S. ( Applied Materials,Inc. )
Ngan,K. ( Applied Materials,Inc. )
Narasimhan,M.K. ( Applied Materials,Inc. )
Forster,J. ( Applied Materials,Inc. )

掲載資料名:

Multilevel Interconnect Technology

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

3214

発行年:

1997

開始ページ:

112

終了ページ:

116

出版情報:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819425461 [081942546X]

言語:

英語

請求記号:

P63600/3214

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00017398
シリーズID:	PA00000029
会議名:	Microelectronic Manufacturing : Multifevel Interconnect Technology
回次:	1997
会議開催地:	Austin, TX, USA
会議開催年:	1997.10.01-1997.10.02

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