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Effects of Processing Conditions and Mold Design on the Flash Behavior of Plastic-Encapsulated Microelectronics Packaging

著者名:
掲載資料名:
ANTEC '97 : plastics saving planet earth, Society of Plastics Engineers, April 27-May 2 : conference proceedings
シリーズ名:
Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers
シリーズ巻号:
43
発行年:
1997
パート:
2
開始ページ:
1448
終了ページ:
1452
総ページ数:
5
出版情報:
Brookfield Center, CT: Society of Plastics Engineers, Inc. (SPE)
ISBN:
9781566765534 [1566765536]
言語:
英語
請求記号:
S42700/43-1
資料種別:
国際会議録

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