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Three-dimensional through-wafer fan-out optical interconnects

著者名:
LeCompte,M. ( Univ.of Delaware )
Gao,X.
Bates,H.
Meckel,J.
Shi,S.
Prather,D.W.
さらに 1 件
掲載資料名:
Optoelectronic interconnects VII : photonics packaging and integrations II : 24-26 January 2000, San Jose, California
シリーズ名:
Proceedings of SPIE - the International Society for Optical Engineering
シリーズ巻号:
3952
発行年:
2000
開始ページ:
318
終了ページ:
328
出版情報:
Bellingham, Wash.: SPIE - The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819435699 [0819435694]
言語:
英語
請求記号:
P63600/3952
資料種別:
国際会議録

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