Blank Cover Image

Oxide chemical mechanical polishing closed-loop time control

著者名:
掲載資料名:
Process, equipment, and materials control in integrated circuit manufacturing V : 22-23 September, 1999, Santa Clara, California
シリーズ名:
Proceedings of SPIE - the International Society for Optical Engineering
シリーズ巻号:
3882
発行年:
1999
開始ページ:
36
終了ページ:
44
出版情報:
Bellingham, Wash.: SPIE - The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819434791 [0819434795]
言語:
英語
請求記号:
P63600/3882
資料種別:
国際会議録

類似資料:

1 国際会議録 Tungsten Chemical-Mechanical Polishing Endpoint Detection

Golzarian, R., Gonzales, S., Luttzen, J., Sue, L., Wertsching, F.

Materials Research Society
7 国際会議録 Improvement of overlay in the oxide- and W-chemical-mechanical polish processes

Yang,S.-S.

SPIE-The International Society for Optical Engineering
2 国際会議録 Novel method of predicting lot polish time for high-volume oxide chemical mechanical polishing

Schroeder,D.J., Buley,T.W., Chan,J.A.

SPIE - The International Society for Optical Engineering
8 国際会議録 Interfacial Pressure Measurements at Chemical-Mechanical Polishing Interfaces

Danyluk, S., Levert, J., Shan, L.

Materials Research Society
3 国際会議録 A Quantitative Model for Oxide Erosion in Chemical Mechanical Polishing of Tungsten

Yoon, B.U., Jeong, I.K, Kim, J.Y., Lee, J.W., Hah, S.R., Moon, J.T., Lee, S.I.

Electrochemical Society
9 国際会議録 The Characteristic of Abrasive Particle in Chemical - Mechanical Polishing

Tsai, H.J., Chang, C.C., Jeng, Y.R., Chen, S.L.

Trans Tech Publications
4 国際会議録 Closed Loop Control of Injection Molding Hold Time

Thomas L. C., Tseng A. A., Bur J. A., Rose L. T.

Society of Plastics Engineers, Inc. (SPE)
10 国際会議録 CHEMICAL-MECHANICAL POLISHING OF TUNGSTEN WITH HOLOGEN-BASED SLURRIES

Yang, K., Gutmann, R. J., Murarka, S. P., Stonebaker, E., Atkins, H.

MRS - Materials Research Society
5 国際会議録 Model-based control of chemical mechanical polishing

Toprac,A.J.

SPIE-The International Society for Optical Engineering
11 国際会議録 Tuning the Removal Rate of Carbon Doped Oxide during Chemical Mechanical Polishing

Z. Liu, J. Bian

Electrochemical Society
6 国際会議録 Characterization of the Chemical Interactions on Copper Chemical Mechanical Polishing

Lee, S.-M., Abiade, J., Choi, W., Singh, R.

Electrochemical Society
12 国際会議録 Polish Rate, Pad Surface Morphology and Pad Conditioning in Oxide Chemical Mechanical Polishing

Lawing, A.S.

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12