Modelling of Grain Structure Evolution and its Impact on the Reliability of Al(Cu) Thin Film Interconnects
- 著者名:
- 掲載資料名:
- Semiconductor process and device performance modeling : symposium held December 2-3, 1997, Boston, Massachusetts, U.S.A.
- シリーズ名:
- Materials Research Society symposium proceedings
- シリーズ巻号:
- 490
- 発行年:
- 1998
- 開始ページ:
- 219
- 出版情報:
- Warrendale, Pa.: MRS - Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558993952 [1558993959]
- 言語:
- 英語
- 請求記号:
- M23500/490
- 資料種別:
- 国際会議録
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10
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COMPUTER SIMULATION OF STRAIN ENERGY AND SURFACE- AND INTERFACE-ENERGY ON GRAIN GROWTH IN THIN FILMS
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