Wafer-bonding technology and its applications in optoelectronic devices

Wafer-bonding technology and its applications in optoelectronic devices

著者名:

Zhu,Z. ( Zhejiang Univ. )

掲載資料名:

Integrated Optoelectronics

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

2891

発行年:

1996

開始ページ:

147

終了ページ:

158

出版情報:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819422927 [0819422924]

言語:

英語

請求記号:

P63600/2891

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00017029
シリーズID:	PA00000029
会議名:	Photonics China : Integrated Optoelectronics
回次:	1996
会議開催地:	Beijing, China
会議開催年:	1996.11.04-1996.11.05

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