Statistical effects of plasma etch damage on hot-carrier degradation

Statistical effects of plasma etch damage on hot-carrier degradation

著者名:

Bhuva,B.L. ( Vanderbilt Univ. )
Janapaty,V. ( Vanderbilt Univ. )
Bui,N. ( Advanced Micro Devices,Inc. )
Kerns,S.E. ( Vanderbilt Univ. )

掲載資料名:

Microelectronic Manufacturing Yield, Reliability, and Failure Analysis III

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

3216

発行年:

1997

開始ページ:

149

終了ページ:

153

出版情報:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819426482 [0819426482]

言語:

英語

請求記号:

P63600/3216

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00016460
シリーズID:	PA00000029
会議名:	Microelectronic Manufacturing : Microelectronic Manufacturing Yield, Reliability, and Failure Analysis
回次:	1997 : 3rd
会議開催地:	Austin, TX, USA
会議開催年:	1997.10.01-1997.10.02

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