Evaluation of pad life in chemical mechanical polishing process using statistical metrology

Evaluation of pad life in chemical mechanical polishing process using statistical metrology

著者名:

Muthukrishnan,N.M. ( LSI Logic Corp. )

Prasad,S. ( LSI Logic Corp. )

Stine,B.E. ( Massachusetts Institute of Technology )

Loh,W. ( LSI Logic Corp. )

Nagahara,R. ( LSI Logic Corp. )

Chung,J.E. ( Massachusetts Institute of Technology )

Boning,D.S. ( Massachusetts Institute of Technology )

さらに 2 件

掲載資料名:

Microelectronic Manufacturing Yield, Reliability, and Failure Analysis III

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

3216

発行年:

1997

開始ページ:

70

終了ページ:

79

出版情報:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819426482 [0819426482]

言語:

英語

請求記号:

P63600/3216

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00016460
シリーズID:	PA00000029
会議名:	Microelectronic Manufacturing : Microelectronic Manufacturing Yield, Reliability, and Failure Analysis
回次:	1997 : 3rd
会議開催地:	Austin, TX, USA
会議開催年:	1997.10.01-1997.10.02

類似資料:

1 テクニカルペーパー Pad Conditioning in Chemical Mechanical Polishing. Hooper, B.J., Byrne, G., Galligan, S. Society of Manufacturing Engineers	7 国際会議録 Evaluation of Commercialized Slurries and Pads for Polymer CMP (Chemical Mechanical Polishing) Zhang, F., Wake, R.W., Cook, L., Busnaina, A.A. Electrochemical Society
2 国際会議録 Statistical metrology:understanding spatial variation in semiconductor manufacturing Boning,D.S., Chung,J.E. SPIE-The International Society for Optical Engineering	8 国際会議録 EFFECT OF POLISHING PAD MATERIAL PROPERTIES ON CHEMICAL MECHANICAL POLISHING (CMP) PROCESSES Bajaj, Rajeev, Desai, Mukesh, Jairath, Rahul, Stell, Matthew, Tolles, Robert MRS - Materials Research Society
3 国際会議録 A New Chemical Mechanical Polishing Method Using the Frozen Etchant Pad Oh, Y.-J., Park, G.-S., Park, S.Y., Jung, T.W., Chun, C.-H. Electrochemical Society	9 国際会議録 Chemical Mechanical Polishing of Copper Using Silica Slurry Kondo, S., Sakuma, N., Homma, Y., Ohashi, N. Electrochemical Society
4 国際会議録 Surface Characterization of Polyurethane Pads Used in Chemical Mechanical Polishing (CMP) Ramsdell, J., Seal, S., Li, I., Richardson, K.A., Desai, V., Easter, W.G. Electrochemical Society	10 国際会議録 Mechanism of Chemical Mechanical Polishing Process for Oxide-Filled Shallow Trench Isolation Applications Prasad, J., Misra, A., Sees, J., Morrison, B., Hall, L. Electrochemical Society
5 国際会議録 Wafer-scale modeling of pattern effect in oxide chemical mechanical polishing Ouma,D., Stine,B., Divecha,R., Boning,D., Chung,J., Shinn,G.B., Ali,I., Clark,J. SPIE-The International Society for Optical Engineering	11 国際会議録 Polish Rate, Pad Surface Morphology and Pad Conditioning in Oxide Chemical Mechanical Polishing Lawing, A.S. Electrochemical Society
6 国際会議録 Inter-and intra-die polysilicon critical dimension variation Stine,B.E., Boning,D.S., Chung,J.E., Bell,D.A., Equi,E. SPIE-The International Society for Optical Engineering	12 国際会議録 A Theoretical Model for Chemical-Mechanical Polishing of Blanket Wafers with Soft Pads Shi, F.G., Zhao, B. Electrochemical Society

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