1.

Conference Proceedings
Conference Proceedings
1. The Influence of Thermal-Mechanical Effects on Resistance Changes During and After Electromigration Experiments
Scorzoni, A. ; Munari, I. De ; Stulens, H. ; D'Haeger, V.
Pub. info.: Materials reliability in microelectronics V : symposium held April 17-21, 1995, San Francisco, California, U.S.A..  pp.513-,  1995.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 391
2.

Conference Proceedings
Conference Proceedings
2. Early Detection of the Metallization Quality Using Moderately Accelerated Electromigration Stress Conditions
Scorzoni, A. ; Munari, I. De ; Impronta, M. ; Balboni, R. ; Kelaidis, N. ; Foley, S. ; Forde, M.
Pub. info.: Materials reliability in microelectronics VIII : symposium held April 13-16, 1998, San Francisco, California, U.S.A..  pp.15-,  1998.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 516
3.

Conference Proceedings
Conference Proceedings
3. NON-DESTRUCTIVE ELECTRICAL TECHNIQUES AS MEANS FOR UNDERSTANDING THE BASIC MECHANISMS OF ELECTROMIGRATION
Scorzoni, A. ; Munari, I. De ; Stulens, H.
Pub. info.: Advanced metallization for devices and circuits--science, technology, and manufacturability : symposium held April 4-8, 1994, San Francisco, California, U.S.A..  pp.515-,  1994.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 337