1.

Conference Proceedings
Conference Proceedings
1. Low Resistance Cathode Metallization and Die-Bonding in Silicon Carbide P-N Junction Diodes
T.H. Kim ; S.Y. Lee ; J.S. Lee ; D.I. Suh ; N.K. Cho ; W. Bahng ; N.K. Kim ; S.Y. Choi ; H.J. Kim ; S.K. Lee
Pub. info.: Silicon carbide and related materials 2006 : ECSCRM 2006, Proceedings of the 6th European Conference on Silicon Carbide and Related Materials, Newcastle upon Tyne, UK, September 2006.  pp.717-720,  2007.  Stafa-Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 556-557
2.

Conference Proceedings
Conference Proceedings
2. A Manipulation of Semiconducting GaN Nanowires by Dielectrophoresis Aligned Assembly Deposition (DAAD)
S.Y. Lee ; T.H. Kim ; D.I. Suh ; J.E. Park ; E.K. Suh ; C.H. Hong ; S.K. Lee
Pub. info.: Silicon carbide and related materials 2006 : ECSCRM 2006, Proceedings of the 6th European Conference on Silicon Carbide and Related Materials, Newcastle upon Tyne, UK, September 2006.  pp.1023-1026,  2007.  Stafa-Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 556-557
3.

Conference Proceedings
Conference Proceedings
3. Effect of Source and Drain Contacts Schottky Barrier on 3C-SiC Nanowire FETs I-V Characteristics
K. Rogdakis ; S.Y. Lee ; D.J. Kim ; S.K. Lee ; E. Bano
Pub. info.: Silicon carbide and related materials 2008 : selected peer reviewed papers from the 7th European Conference on Silicon Carbide and Related Materials, September 7-11 Barcelona, Spain.  pp.235-238,  2009.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 615-617