Contact hole resolution enhancement by post exposure amine treatment (CONPEAT) process
- Author(s):
Koh, C.-W. ( Hynix Semiconductor, Inc. (Korea) ) Kim, J.-S. Choi, C.-I. Eom, T.-S. Kwon, W.-T. Jung, J.-C. Bok, C.-K. Shin, K.-S. - Publication title:
- Advances in Resist Technology and Processing XIX
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 4690
- Pub. Year:
- 2002
- Vol.:
- Part Two
- Page(from):
- 793
- Page(to):
- 798
- Pages:
- 6
- Pub. info.:
- Bellingham, Wash.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819444363 [0819444367]
- Language:
- English
- Call no.:
- P63600/4690
- Type:
- Conference Proceedings
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