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Manufacturing and Microstructure of Cu Coated Diamonds/SnAgCu Composite Solder Bumps

Author(s):
Publication title:
Advanced mechanical engineering III : selected, peer reviewed papers from the 2013 International Conference on Advanced Mechanical Engineering (AME 2013), Wuhan, China, 2-3 February 2013
Title of ser.:
Applied mechanics and materials
Ser. no.:
288
Pub. Year:
2013
Page(from):
323
Page(to):
327
Pages:
5
Pub. info.:
Stafa-Zuerich: Trans Tech Publications
ISSN:
16609336
ISBN:
9781627480567 [1627480560]
Language:
English
Call no.:
A69500/288
Type:
Conference Proceedings

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