1.

Conference Proceedings
Conference Proceedings
1. X-Ray Characterization of Bonding Interfaces
Rieutord, F. ; Moriceau, H. ; Bataillou, B. ; Morales, C. ; Eymery J.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.338-345,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02
2.

Conference Proceedings
Conference Proceedings
2. Overview on Some Recent Advances in Wafer Bonding Technologies
Moriceau, H. ; Fournel, F. ; Rayssac, O. ; Cartier, A.M. ; Morales, C. ; Pocas, S. ; Zussy, M. ; Jalaguier, E. ; Biasse, B. ; Bataillou, B. ; Papon, A.M. ; Lagahe, C. ; Aspar, B. ; Maleville, C. ; Leterte, F. ; Ghyselen, B. ; Barge, T.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.1-16,  2001.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-27
3.

Conference Proceedings
Conference Proceedings
3. Interest of a Short Plasma Treatment to achieve High Quality Si-SiO2-Si Bonded Structures
Moriceau, H. ; Bataillou, B. ; Morales, C. ; Cartier, A.M. ; Rieutord, F.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.110-117,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
4.

Conference Proceedings
Conference Proceedings
4. Investigations of Buried Interfaces Using High Energy X-ray Reflectivity
Rieutord, F. ; Eymery, J. ; Plantevin, O. ; Bataillou, B. ; Buttard, D. ; Fournel, F.
Pub. info.: Application of synchrotron radiation techniques to materials science VI : symposium held April 16-20, 2001, San Francisco, California, U.S.A..  2001.  Warrendale, Penn..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 678