1.

Conference Proceedings

Conference Proceedings
Harendt, C. ; Schuhbauer, A. ; Apel, U. ; Dudek, V. ; Graf, H.-G. ; Hoefflinger, B. ; Penteker, E.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.501-508,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
2.

Conference Proceedings

Conference Proceedings
Harendt, C. ; Beintner, J. ; Schunbauer, A. ; Apel, U. ; Dudek, V. ; Graf, H.-G. ; Hoefflinger, B. ; Seger, U.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.568-575,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
3.

Conference Proceedings

Conference Proceedings
Kerstein, L. ; Bischof, B. ; Renken, H. ; Hoffmann, H. ; Apel, U.
Pub. info.: Proceedings of the fifth IAA International conference on low-cost planetary missions, 24-26 September 2003, ESTEC, Noordwijk, the Netherlands.  pp.17-24,  2003.  Noordwijk, Netherlands.  ESA Publications Division
Title of ser.: ESA SP
Ser. no.: 542
4.

Technical Paper

Technical Paper
Apel, U.
Pub. info.: A collection of technical papers : AIAA/ICAS international air and space symposium and exposition: the next 100 years, Dayton, Ohio, 14-17 July 2003.  v. 3  pp.2593-2600,  2003.  Reston, Va.  American Institute of Aeronautics and Astronautics
Title of ser.: AIAA Paper : AIAA/ICAS International Air and Space Symposium and Exposition
Ser. no.: 2003