Recent Advances on a Wafer-Level Flip Chip Packaging Process.

Recent Advances on a Wafer-Level Flip Chip Packaging Process.

Author(s):

Publication title:

SME technical paper

Pub. Year:

2001

No.:

FC01-138

Paper no.:

FC01-138

Pages:

7

Pub. info.:

Society of Manufacturing Engineers

Language:

English

Type:

Technical Paper

Details

TDL ID:

ZA00001683

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