1.

Conference Proceedings

Conference Proceedings
Sasaki, Y. ; Maeda, J. ; Koishi, T. ; Hashimoto, K. ; Shibahara, K. ; Yokoyama, S. ; Miyazaki, S. ; Hirose, M.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.207-213,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
2.

Conference Proceedings

Conference Proceedings
Radzimski, Z. J. ; Yokoyama, S. ; Ishibashi, I. ; Hirose, M.
Pub. info.: Diagnostic techniques for semiconductor materials processing : Symposium held November 29-December 2, 1993, Boston, Massachusetts, U.S.A..  pp.409-,  1994.  Pittsburgh.  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 324
3.

Conference Proceedings

Conference Proceedings
Alay, J. L. ; Fukuda, M. ; Bjorkman, C. H. ; Nakagawa, K. ; Sasaki, S. ; Yokoyama, S. ; Hirose, M.
Pub. info.: Ultraclean semiconductor processing technology and surface chemical cleaning and passivation : Symposum held April 17-19, 1995, San Francisco, California, USA.  pp.249-,  1995.  Pittsburgh, PA.  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 386