1.

Conference Proceedings
Conference Proceedings
1. Thermal Stability of Organic Interlayer with Low Dielectric Constant
Hara, T. ; Takasoh, J. ; Yang, H. ; Tweet, D.J. ; Nguyen, T. ; Ma, Y. ; Evans, D.R. ; Hsu, S.T.
Pub. info.: Dielectric material integration for microelectronics.  pp.79-87,  1998.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 98-3
2.

Conference Proceedings
Conference Proceedings
2. Multilevel Damascene Interconnection in Integration of MOCVD Cu and Low-K Fluorinated Amorphous Carbon
Evans, D. R. ; Hsu, S-T. ; Nguyen, T. ; Stecker, L. H. ; Ulrich, B. ; Yang, H.
Pub. info.: Low-dielectric constant materials V : symposium held April 5-8, 1999, San Francisco, California, U.S.A..  pp.129-136,  1999.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 565