Blank Cover Image

Thermal Management Design from Chip to Package for High Power InGaN/sapphire LEDs Applications

Author(s):
Publication title:
State-of-the-Art Program on Compound Semiconductors 49 (SOTAPOCS 49) and Nitrides and Wide-Bandgap Semiconductors for Sensors, Photonics, and Electronics 9
Title of ser.:
ECS transactions
Ser. no.:
16(7)
Pub. Year:
2008
Page(from):
111
Page(to):
115
Pages:
5
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
19385862
ISBN:
9781566776530 [1566776538]
Language:
English
Call no.:
E23400/16-7
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Enhanced Thermal Dissipation and Light Output of GaN/Sapphire Light-Emitting Diode by Direct Cu Electroplating

C. Chiang, R. Horng, D. Wuu, H. Hsiao, C. Hsieh

Electrochemical Society
7 Conference Proceedings GaN-Based Light-Emitting Diodes for Vertical Current Injection by Laser Lift-off and Wafer Bonding Techniques

Horng, R.-H., Pan, K.-F., Lee, C.-E., Hung, S.-H., Lin, W.-Y., Su, Y.-Y., Yang, C.-C., Wuu, D.-S.

Electrochemical Society
2 Conference Proceedings Stability Effects of Reflective Mirror on GaN LED/Mirror/Si Via Wafer Bonding and Laser Lift-Off Techniques

R. Horng, S. Huang, D. Wuu, C. Lin, H. Liu

Electrochemical Society
8 Conference Proceedings High Thermal Conductivity Graphite Copper Composites with Diamond Coatings for Thermal Management Packaging Applications

Stoessel, Chris H., Pan, C., Withers, J. C., Wallace, D., Loutfy, R. O.

MRS - Materials Research Society
3 Conference Proceedings Highly efficient InGaN/GaN LEDs with double-sided textured surfaces and omni-directional mirror structure

D.-S. Wuu, S.-H. Huang, R.-H. Horng, C.-Y. Hsieh, K.-W. Yen

Society of Photo-optical Instrumentation Engineers
9 Conference Proceedings Remote temperature mapping of high-power InGaN/GaN MQWflip-chip design LEDs [5941-54]

Malyutenko, V. K., Malyutenko, Yu O., Zinovchuk, A. V., Zakhein, A. L., Zakhein, D. A., Smirnova,. L. P., Gurevich, S. …

SPIE - The International Society of Optical Engineering
4 Conference Proceedings Transparent Barrier Coatings on Flexible Polyethersulfone Substrates for Moisture-Resistant Applications

Wuu, D. S., Lo, W. C., Chiang, C. C., Lin, H. B., Chang, L. S., Horng, R. H., Huang, C. L., Gao, Y. J.

Trans Tech Publications
10 Conference Proceedings Chip-scale thermal management of high-brightness LED packages

Arik, M., Weaver, S.

SPIE - The International Society of Optical Engineering
5 Conference Proceedings Thermal ink-jet device using single-chip silicon microchannels

Wuu,D.-S., Cheng,C.Y., Horng,R.H., Chan,G.C., Chiu,S.-L., Wu,Y.-Y.

SPIE-The International Society for Optical Engineering
11 Conference Proceedings Initial growth effects on the properties of GaN buffer layer and subsequent GaN overlayer by MOCVD

Wuu,D.-S., Tseng,W.-H., Lin,W.-T., Horng,R.-H.

SPIE - The International Society for Optical Engineering
6 Conference Proceedings Fabrication and Characterization of InGaN-Based Green Resonant Cavity Light-Emitting Diodes Using H+ Ion-Implantation

R. Horng, S. Huang, H. Kuo, D. Wuu

Electrochemical Society
12 Conference Proceedings High-power GaN LED chip with low thermal resistance

S. Hon, C. T. Kuo, T. P. Chen, M. H. Hsieh

Society of Photo-optical Instrumentation Engineers
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12