1.

Conference Proceedings
Conference Proceedings
1. Direct Observation of Dielectric Breakdown at Step-Bunching on 4H-SiC
Y. Mori ; M. Matsumura ; H. Hamamura ; T. Mine ; A. Shima
Pub. info.: Silicon Carbide and Related Materials 2014 : Selected peer reviewed papers from the European Conference on Silicon Carbide & Related Materials (ECSCRM 2014), September 21-25, 2014, Grenoble, France.  pp.468-471,  2015.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 821-823
2.

Conference Proceedings
Conference Proceedings
2. 3.3 kV 4H-SiC DMOSFET with Highly Reliable Gate Insulator and Body Diode
A. Shima ; H. Shimizu ; Y. Mori ; M. Sagawa ; K. Konishi ; R. Fujita ; T. Ishigaki ; N. Tega ; K. Kobayashi ; S. Sato ; Y. Shimamoto
Pub. info.: Silicon Carbide and Related Materials 2016.  pp.493-496,  2017.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 897