1.

Conference Proceedings
Conference Proceedings
1. Copper Diffusion and Corrosion Behavior Through the Hillock Defect Found Beneath the Weak SiN Dielectric Barrier in Dual Damascene Process
S. Kim ; C. Shim ; J. Hong ; H. Lee ; J. Han ; K. Kim ; Y. Kim
Pub. info.: Dielectrics for nanosystems II: materials science, processing, reliability, and manufacturing.  pp.237-242,  2006.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 2(1)
2.

Conference Proceedings
Conference Proceedings
2. Ink-Jet Printed 6,13-bis(triisopropylsilylethynyl) Pentacene Organic Thin-Film Transistors for Particle Based Electronic Papers
Y. Kim ; S. Park ; M. Han ; J. Han
Pub. info.: Thin Film Transistors 9.  pp.267-272,  2008.  Pennington, NJ.  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 16(9)