1.

Conference Proceedings
Conference Proceedings
1. Copper Diffusion and Corrosion Behavior Through the Hillock Defect Found Beneath the Weak SiN Dielectric Barrier in Dual Damascene Process
S. Kim ; C. Shim ; J. Hong ; H. Lee ; J. Han ; K. Kim ; Y. Kim
Pub. info.: Dielectrics for nanosystems II: materials science, processing, reliability, and manufacturing.  pp.237-242,  2006.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 2(1)
2.

Technical Paper
Technical Paper
2. Structural Optimization of a Joined-Wing Using Equivalent Static Loads
H. Lee ; Y. Kim ; G. Park ; R. Kolonay ; M. Blair ; R. Canfield
Pub. info.: AIAA meeting papers on disc.  2006.  Reston, Va.  American Institute of Aeronautics and Astronautics
Title of ser.: AIAA Paper : Multidisciplinary Analysis and Optimization Conference
Ser. no.: 2006