1.

Technical Paper
Technical Paper
1. Fatigue properties of microelectronics solder joints
Nir, N. ; Dudderar, T. D. ; Wong, C. C. ; Storm, A. R.
Pub. info.: A.S.M.E. paper.  1990.  New York, NY.  The American Society of Mechanical Engineers
Title of ser.: ASME Technical Paper : WA/EEP
Ser. no.: 1990
2.

Technical Paper
Technical Paper
2. Computational Analysis of Fluid-Wall Interactions in Micro-and Nano-Domains.
Wong, C. C. ; Noble, D. R.
Pub. info.: A.S.M.E. paper.  2003.  New York, NY.  American Society of Mechanical Engineers
Title of ser.: ASME Technical Paper : IMECE
Ser. no.: 2003
3.

Technical Paper
Technical Paper
3. Characterizing Gaseous Flow in Submicron Chromatography Columns.
Wong, C. C.
Pub. info.: A.S.M.E. paper.  2003.  New York, NY.  American Society of Mechanical Engineers
Title of ser.: ASME Technical Paper : IMECE
Ser. no.: 2003