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11 results

Conference Proceedings

1. Strength and long-term reliability testing of wafer-bonded MEMS

Petzold, M. ; Katzer, D. ; Wiemer, M. ; Bagdahn, J.

Pub. info.:	Design, test, integration, and packaging of MEMS/MOEMS 2002 : 6-8 May, 2002, Cannes, France. pp.613-623, 2002. Bellingham, Wash.. SPIE-The International Society for Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	4755

Conference Proceedings

2. The Influence of Sharp Notches on the Strength of Directly Bonded Components

Bagdahn, J. ; Katzer, D. ; Petzold, M. ; Wiemer, M.

Pub. info.:	Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications. pp.285-290, 1997. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	97-36

Conference Proceedings

3. Application of High and Low Wafer Bonding Processes for Bulk Micromachined Components

Wiemer, M. ; Hiller, K. ; Hahn, R. ; Kaufmann, C. ; Gessner, T.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.368-380, 1999. Pennington, N.J.. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	99-35

Conference Proceedings

4. Measurement of the Local Strength Distribution of Directly Bonded Silicon Wafers using the Micro-Chevron Test

Bagdahn, J. ; Ploessl, A. ; Wiemer, M. ; Petzold, M.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.218-223, 1999. Pennington, N.J.. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	99-35

Conference Proceedings

5. Fabrication of SOI Substrates with Buried Silicide Layers for BiCMOS Applications

Wiemer, M. ; Zimmermann, S. ; Zhao, Q.T. ; Trui, B. ; Kaufmann, C. ; Mantl, S. ; Dudek, V. ; Gessner, T.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.303-310, 2005. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2005-02

Conference Proceedings

6. Mechanical Reliability of Directly Bonded Silicon MEMS Components

Bagdahn, J. ; Wiemer, M. ; Petzold, M.(Invited)

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.253-263, 2005. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2005-02

Conference Proceedings

7. Bonding and Contacting of MEMS-Structures on Wafer Level

Wiemer, M. ; Fromel, J. ; Jia, C. ; Gessner, T.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.301-308, 2003. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2003-19

Conference Proceedings

8. Silicon Wafer Bonding for Encapsulating Surface-Micromechanical-Systems using Intermediate Glass Layers

Knechtel, R. ; Heller, J. ; Wiemer, M. ; Fromel, J.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.321-328, 2003. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2003-19

Conference Proceedings

9. Bonding and Metallization for a High Precision Acceleration Sensor

Gessner, T. ; Wiemer, M. ; Hiller, K. ; Hafen, M.

Pub. info.:	Proceedings of the Second International Symposium on Microstructures and Microfabricated Systems. pp.297-308, 1995. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	95-27

10.

Conference Proceedings

10. Packaging for MEMS devices: stumbling block or enabling solution?

Jung, E. ; Wiemer, M. ; Grosser, V. ; Bock, K. ; Wolf, J.

Pub. info.:	Design, test, integration, and packaging of MEMS/MOEMS 2002 : 6-8 May, 2002, Cannes, France. pp.508-514, 2002. Bellingham, Wash.. SPIE-The International Society for Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	4755

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