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Design, test, integration, and packaging of MEMS/MOEMS 2002 : 6-8 May, 2002, Cannes, France. pp.613-623, 2002. Bellingham, Wash.. SPIE-The International Society for Optical Engineering
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Proceedings of SPIE - the International Society for Optical Engineering
Bagdahn, J. ; Katzer, D. ; Petzold, M. ; Wiemer, M.
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Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications. pp.285-290, 1997. Pennington, NJ. Electrochemical Society
Wiemer, M. ; Hiller, K. ; Hahn, R. ; Kaufmann, C. ; Gessner, T.
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Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.368-380, 1999. Pennington, N.J.. Electrochemical Society
Bagdahn, J. ; Ploessl, A. ; Wiemer, M. ; Petzold, M.
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Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.218-223, 1999. Pennington, N.J.. Electrochemical Society
Wiemer, M. ; Zimmermann, S. ; Zhao, Q.T. ; Trui, B. ; Kaufmann, C. ; Mantl, S. ; Dudek, V. ; Gessner, T.
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Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.303-310, 2005. Pennington, NJ. Electrochemical Society
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Design, test, integration, and packaging of MEMS/MOEMS 2002 : 6-8 May, 2002, Cannes, France. pp.508-514, 2002. Bellingham, Wash.. SPIE-The International Society for Optical Engineering
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering