1.

Conference Proceedings
Conference Proceedings
1. Strength and long-term reliability testing of wafer-bonded MEMS
Petzold, M. ; Katzer, D. ; Wiemer, M. ; Bagdahn, J.
Pub. info.: Design, test, integration, and packaging of MEMS/MOEMS 2002 : 6-8 May, 2002, Cannes, France.  pp.613-623,  2002.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4755
2.

Conference Proceedings
Conference Proceedings
2. The Influence of Sharp Notches on the Strength of Directly Bonded Components
Bagdahn, J. ; Katzer, D. ; Petzold, M. ; Wiemer, M.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.285-290,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
3.

Conference Proceedings
Conference Proceedings
3. Measurement of the Local Strength Distribution of Directly Bonded Silicon Wafers using the Micro-Chevron Test
Bagdahn, J. ; Ploessl, A. ; Wiemer, M. ; Petzold, M.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.218-223,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-35
4.

Conference Proceedings
Conference Proceedings
4. Mechanical Reliability of Directly Bonded Silicon MEMS Components
Bagdahn, J. ; Wiemer, M. ; Petzold, M.(Invited)
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.253-263,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02