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Characterization and reduction of copper chemical-mechanical-polishing-induced scratches

Author(s):
Teo, T.Y. ( Nanyang Technological Univ. (Singapore) )
Goh, W.L. ( Nanyang Technological Univ. (Singapore) )
Leong, L.S. ( Chartered Semiconductor Manufacturing, Ltd. (Singapore) )
Lim, V.S.K. ( Chartered Semiconductor Manufacturing, Ltd. (Singapore) )
Tse, T.Y. ( Chartered Semiconductor Manufacturing, Ltd. (Singapore) )
Chan, L. ( Chartered Semiconductor Manufacturing, Ltd. (Singapore) )
1 more
Publication title:
Process and Materials Characterization and Diagnostics in IC Manufacturing
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5041
Pub. Year:
2003
Page(from):
61
Page(to):
69
Pages:
9
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819448460 [081944846X]
Language:
English
Call no.:
P63600/5041
Type:
Conference Proceedings

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