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Intermetallic compound formation in hot aluminum metallization and its effect on etching and electromigration

Author(s):
Liu,L. ( Institute of Microelectronics )
Lu,D.
Foo,P.
Tan,W.
Kowk,K.
Zou,G.
Tse,M.
2 more
Publication title:
Microelectronic Device and Multilevel Interconnection Technology II
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
2875
Pub. Year:
1996
Page(from):
334
Page(to):
344
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819422736 [0819422738]
Language:
English
Call no.:
P63600/2875
Type:
Conference Proceedings

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